{"id":112096,"date":"2025-11-26T10:12:11","date_gmt":"2025-11-26T10:12:11","guid":{"rendered":"https:\/\/ekamu.net\/?p=112096"},"modified":"2025-11-26T10:12:11","modified_gmt":"2025-11-26T10:12:11","slug":"google-yeni-nesil-tpulari-icin-intelin-kapisini-calabilir","status":"publish","type":"post","link":"https:\/\/ekamu.net\/index.php\/2025\/11\/26\/google-yeni-nesil-tpulari-icin-intelin-kapisini-calabilir\/","title":{"rendered":"Google, yeni nesil TPU\u2019lar\u0131 i\u00e7in Intel\u2019in kap\u0131s\u0131n\u0131 \u00e7alabilir"},"content":{"rendered":"

\n

<\/span> <\/figure>\n<\/p>\n

Intel<\/strong>\u2019in geli\u015fmi\u015f paketleme teknolojilerine y\u00f6nelik ilgi h\u0131zla artarken kaynaklar\u0131ndan gelen yeni bilgiler, \u015firketin Google<\/strong>\u2019\u0131n gelecek nesil TPU<\/strong> mimarileri i\u00e7in EMIB<\/strong> paketleme tedarik\u00e7isi olabilece\u011fini ortaya koyuyor. TrendForce\u2019un de\u011ferlendirmelerine g\u00f6re Google\u2019\u0131n 2027\u2019de piyasaya \u00e7\u0131kmas\u0131 beklenen TPU v9<\/strong> h\u0131zland\u0131r\u0131c\u0131lar\u0131nda EMIB\u2019in kullan\u0131lmas\u0131 g\u00fcndemde. Benzer \u015fekilde, Meta<\/strong> taraf\u0131ndan geli\u015ftirilen MTIA<\/strong> yapay zeka \u00e7iplerinde de ayn\u0131 teknolojinin tercih edilmesi konu\u015fuluyor.<\/p>\n

Intel\u2019e ilgi art\u0131yor<\/b><\/p>\n

Sekt\u00f6rdeki yo\u011fun ilginin temel nedeni ABD\u2019de geli\u015fmi\u015f paketleme kapasitesinin s\u0131n\u0131rl\u0131 olmas\u0131 ve Intel\u2019in \u015fu anda \u00fclke i\u00e7inde EMIB seviyesinde paketleme sunabilen tek sa\u011flay\u0131c\u0131 konumunda bulunmas\u0131. TSMC her ne kadar CoWoS teknolojisini ABD\u2019ye ta\u015f\u0131mak i\u00e7in yat\u0131r\u0131mlar y\u00fcr\u00fctse de bu kapasitenin tam olarak devreye al\u0131nmas\u0131n\u0131n uzun zaman alaca\u011f\u0131 belirtiliyor. Nvidia ve AMD, TSMC\u2019nin ileri paketleme hatlar\u0131nda b\u00fcy\u00fck yer kaplad\u0131\u011f\u0131ndan ASIC geli\u015ftiriciler i\u00e7in Intel bir alternatif haline geliyor<\/strong>.<\/p>\n

<\/span> <\/figure>\n<\/p>\n

Intel, EMIB platformuna uzun zamand\u0131r yat\u0131r\u0131m yap\u0131yor ve halihaz\u0131rda Sapphire Rapids<\/strong> ve Granite Rapids<\/strong> gibi veri merkezi i\u015flemcilerinde aktif olarak kullan\u0131yor. Raporda ayr\u0131ca firman\u0131n geli\u015fmi\u015f 3D y\u0131\u011f\u0131n \u00f6z\u00fcm\u00fc olarak bilinen Foveros Direct3D<\/strong> teknolojisinin de \u00f6ne \u00e7\u0131kt\u0131\u011f\u0131 belirtiliyor. Bu yakla\u015f\u0131m, chiplet<\/strong> mimarilerinin birbirine y\u00fcksek bant geni\u015fli\u011fiyle ba\u011flanmas\u0131n\u0131 sa\u011flayarak performans iyile\u015ftirmelerinde kritik rol \u00fcstleniyor. Sekt\u00f6rdeki baz\u0131 kaynaklar Nvidia gibi \u015firketlerin gelecekte bu \u00e7\u00f6z\u00fcme y\u00f6nelmeyi de\u011ferlendirdi\u011fini aktar\u0131yor.<\/p>\n

Her ne kadar Intel\u2019in d\u0131\u015f m\u00fc\u015fterilerden talep g\u00f6rmesi ileri paketleme ekosisteminde dikkate de\u011fer bir de\u011fi\u015fim yarat\u0131yor olsa da TrendForce, bu durumun TSMC\u2019yi etkilemeyece\u011fini s\u00f6yl\u00fcyor. CoWoS zaten kendini kan\u0131tlam\u0131\u015f durumda ancak farkl\u0131 oyuncular\u0131n oyuna dahil olmas\u0131 tedarik zincirini \u00e7e\u015fitlendirecektir.<\/p>\n\n

<\/span><\/p>\n

Kaynak :\u00a0https:\/\/www.donanimhaber.com\/google-yeni-nesil-tpu-lari-icin-intel-in-kapisini-calabilir–198996<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

Intel\u2019in geli\u015fmi\u015f paketleme teknolojilerine y\u00f6nelik ilgi h\u0131zla artarken kaynaklar\u0131ndan gelen yeni bilgiler, \u015firketin Google\u2019\u0131n gelecek nesil TPU mimarileri i\u00e7in EMIB paketleme tedarik\u00e7isi olabilece\u011fini ortaya koyuyor. TrendForce\u2019un …<\/p>\n","protected":false},"author":1,"featured_media":112097,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[8],"tags":[1257,2192,431],"class_list":["post-112096","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-teknoloji","tag-intel","tag-paketleme","tag-tek"],"_links":{"self":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/112096","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/comments?post=112096"}],"version-history":[{"count":1,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/112096\/revisions"}],"predecessor-version":[{"id":112100,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/112096\/revisions\/112100"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/media\/112097"}],"wp:attachment":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/media?parent=112096"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/categories?post=112096"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/tags?post=112096"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}