{"id":74917,"date":"2024-08-31T18:00:09","date_gmt":"2024-08-31T18:00:09","guid":{"rendered":"https:\/\/ekamu.net\/?p=74917"},"modified":"2024-08-31T18:00:09","modified_gmt":"2024-08-31T18:00:09","slug":"yari-iletken-pazarinda-cam-substrat-yarisi","status":"publish","type":"post","link":"https:\/\/ekamu.net\/index.php\/2024\/08\/31\/yari-iletken-pazarinda-cam-substrat-yarisi\/","title":{"rendered":"Yar\u0131 iletken pazar\u0131nda &#8220;cam substrat&#8221; yar\u0131\u015f\u0131"},"content":{"rendered":"<p><figure> <span> <img decoding=\"async\" src=\"https:\/\/ekamu.net\/wp-content\/uploads\/2024\/08\/yari-iletken-pazarinda-cam-substrat-yarisi-0-kEVYMHif.jpg\"\/> <\/span> Son d\u00f6nemde yar\u0131 iletken end\u00fcstrisinde b\u00fcy\u00fck bir heyecan uyand\u0131ran <strong>cam substrat<\/strong> (veya alt tabaka) teknolojisi, sekt\u00f6rdeki dev oyuncular\u0131n dikkatini \u00e7ekiyor. \u00d6zellikle <strong>yapay zeka<\/strong> (AI) pazar\u0131n\u0131n h\u0131zla b\u00fcy\u00fcmesi, performans art\u0131\u015flar\u0131n\u0131 s\u00fcrd\u00fcrebilmek ad\u0131na yeni teknolojilere olan ihtiyac\u0131 da beraberinde getiriyor. Yeni bir rapora g\u00f6re <strong>TSMC<\/strong> ve <strong>Intel<\/strong>, Ar-Ge \u00e7al\u0131\u015fmalar\u0131n\u0131 agresif bir \u015fekilde geni\u015fletmek istiyor. Nvidia ise cam substrat teknolojisini kullanmaya \u00f6ncelik vermeye haz\u0131rlan\u0131yor. <\/figure>\n<p>Geleneksel olarak <strong>yar\u0131 iletken paketleme<\/strong> s\u00fcre\u00e7lerinde kullan\u0131lan y\u00f6ntemler, mevcut teknolojinin s\u0131n\u0131rlar\u0131n\u0131 zorluyor. \u00d6zellikle h\u0131zla geli\u015fen AI ve y\u00fcksek performansl\u0131 hesaplama (HPC) alanlar\u0131nda, daha b\u00fcy\u00fck yonga boyutlar\u0131 ve daha y\u00fcksek transist\u00f6r yo\u011funluklar\u0131 i\u00e7in yeni \u00e7\u00f6z\u00fcmler gerekli hale geldi. Bu noktada cam substratlar, geleneksel <strong>CoWoS paketleme teknolojisinin yerini alabilecek<\/strong> <strong>potansiyele<\/strong> <strong>sahip<\/strong>. Cam substratlar, daha ince ve daha dayan\u0131kl\u0131 yap\u0131lar\u0131 sayesinde, yonga boyutlar\u0131n\u0131 art\u0131r\u0131rken ayn\u0131 zamanda transist\u00f6r yo\u011funlu\u011funu da art\u0131rabiliyor.<\/p>\n<p><b>Intel avantajl\u0131<\/b><\/p>\n<figure> <span> <img decoding=\"async\" src=\"https:\/\/ekamu.net\/wp-content\/uploads\/2024\/08\/yari-iletken-pazarinda-cam-substrat-yarisi-1-eelG2HFB.jpg\"\/> <\/span> \u00d6te yandan cam substrat teknolojisinde liderli\u011fi kim ele ge\u00e7irecek sorusu, sekt\u00f6rde b\u00fcy\u00fck bir merak konusu. <strong>Intel<\/strong>, bu alandaki \u00e7al\u0131\u015fmalar\u0131n\u0131 on y\u0131l\u0131 a\u015fk\u0131n bir s\u00fcredir s\u00fcrd\u00fcr\u00fcyor ve <strong>seri \u00fcretime haz\u0131r <\/strong>oldu\u011funu belirtiyor. Ancak <strong>TSMC<\/strong>, <strong>Nvidia<\/strong>\u2019n\u0131n talepleri do\u011frultusunda bu teknolojiyi gelecekteki <strong>FOPLP <\/strong>(Fan-Out Panel Level Packaging) paketleme s\u00fcre\u00e7lerine entegre etmek i\u00e7in \u00e7al\u0131\u015fmalar\u0131n\u0131 h\u0131zland\u0131rm\u0131\u015f durumda. Ayr\u0131ca <strong>Samsung Electronics <\/strong>ve <strong>Huawei<\/strong>&#8216;nin bir at\u0131l\u0131m elde etmek i\u00e7in cam alt tabaka Ar-Ge s\u00fcrecine yo\u011fun bir \u015fekilde yat\u0131r\u0131m yapt\u0131\u011f\u0131 ancak y\u00f6ntem naif oldu\u011fu i\u00e7in hala gidilecek uzun bir yol oldu\u011fu belirtiliyor. <\/figure>\n<p>Rapora g\u00f6re, <strong>Tayvan<\/strong> merkezli bir\u00e7ok \u00fcretici cam substrat\u0131 &#8220;<strong>gelece\u011fe bir yat\u0131r\u0131m<\/strong>&#8221; olarak g\u00f6r\u00fcyor. Bu ba\u011flamda, <strong>Titanium<\/strong> gibi firmalar, cam substrat ekipman \u00fcreticilerini bir araya getiren yeni bir ittifak olan &#8220;<strong>E Core<\/strong>&#8220;u olu\u015fturdu. Cam substrat teknolojisinin piyasalara ne zaman girece\u011fi sorusu da yan\u0131t bulmu\u015f durumda. \u00d6nde gelen \u00fcreticiler, bu yenilik\u00e7i \u00e7\u00f6z\u00fcmleri 2025-2026 d\u00f6neminde piyasaya s\u00fcrmeyi hedefliyor. Intel ve TSMC, bu s\u00fcre\u00e7te en \u00f6nde gelen isimler olacak gibi g\u00f6r\u00fcn\u00fcyor.<\/p>\n\n<p><span style=\"display: block; width: 343.125px; color: rgb(55, 58, 60); font-size: 14px; background-color: rgb(255, 249, 236);\"><\/span><\/p>\n<p>Kaynak :\u00a0<span style=\"background-color: rgb(255, 249, 236); color: rgb(55, 58, 60); font-size: 14px;\">https:\/\/www.donanimhaber.com\/yari-iletken-pazarinda-cam-substrat-yarisi&#8211;181360<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Son d\u00f6nemde yar\u0131 iletken end\u00fcstrisinde b\u00fcy\u00fck bir heyecan uyand\u0131ran cam substrat (veya alt tabaka) teknolojisi, sekt\u00f6rdeki dev oyuncular\u0131n dikkatini \u00e7ekiyor. \u00d6zellikle yapay zeka (AI) pazar\u0131n\u0131n h\u0131zla b\u00fcy\u00fcmesi, performans art\u0131\u015flar\u0131n\u0131 s\u00fcrd\u00fcrebilmek &#8230;<\/p>\n","protected":false},"author":1,"featured_media":74918,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[8],"tags":[],"class_list":["post-74917","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-teknoloji"],"_links":{"self":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/74917","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/comments?post=74917"}],"version-history":[{"count":1,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/74917\/revisions"}],"predecessor-version":[{"id":74921,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/74917\/revisions\/74921"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/media\/74918"}],"wp:attachment":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/media?parent=74917"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/categories?post=74917"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/tags?post=74917"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}