{"id":83914,"date":"2024-10-04T19:24:04","date_gmt":"2024-10-04T19:24:04","guid":{"rendered":"https:\/\/ekamu.net\/?p=83914"},"modified":"2024-10-04T19:24:04","modified_gmt":"2024-10-04T19:24:04","slug":"tsmc-gelismis-paketleme-teknolojisi-abdye-tasiyor","status":"publish","type":"post","link":"https:\/\/ekamu.net\/index.php\/2024\/10\/04\/tsmc-gelismis-paketleme-teknolojisi-abdye-tasiyor\/","title":{"rendered":"TSMC, geli\u015fmi\u015f paketleme teknolojisi ABD\u2019ye ta\u015f\u0131yor"},"content":{"rendered":"<p><figure> <span> <img decoding=\"async\" src=\"https:\/\/ekamu.net\/wp-content\/uploads\/2024\/10\/tsmc-gelismis-paketleme-teknolojisi-abdye-tasiyor-0-iiFuwndc.jpg\"\/> <\/span> ABD, son y\u0131llarda yar\u0131 iletken \u00fcretimi ve teknolojisini kendi s\u0131n\u0131rlar\u0131 i\u00e7ine \u00e7ekmek i\u00e7in \u00f6nemli ad\u0131mlar atarken, bu y\u00f6nde at\u0131lan en son ad\u0131m Tayvan merkezli <strong>TSMC <\/strong>ile ABD&#8217;li <strong>Amkor Technologies<\/strong> aras\u0131ndaki stratejik i\u015fbirli\u011fi oldu. TSMC ve Amkor, ABD\u2019de ileri seviye <strong>\u00e7ip paketleme<\/strong> teknolojisini hayata ge\u00e7irmek i\u00e7in i\u015fbirli\u011fi yaparak, yapay zeka donan\u0131mlar\u0131 ve y\u00fcksek performansl\u0131 bilgi i\u015flem sekt\u00f6rlerine \u00f6nemli bir ivme kazand\u0131rmay\u0131 hedefliyor. <\/figure>\n<p><b>ABD ve yapay zeka \u00e7ipleri i\u00e7in \u00f6nemli bir ad\u0131m<\/b><\/p>\n<p>TSMC ve Amkor Technologies, bug\u00fcn yapt\u0131klar\u0131 a\u00e7\u0131klamada, Arizona\u2019da yer alacak ileri d\u00fczey paketleme ve test hizmetleri sunacak bir tesis i\u00e7in i\u015fbirli\u011fi anla\u015fmas\u0131 imzalad\u0131klar\u0131n\u0131 duyurdu. Bu yeni tesis, TSMC&#8217;nin ayn\u0131 b\u00f6lgedeki wafer \u00fcretim tesisleri ile yak\u0131n bir i\u015fbirli\u011fi i\u00e7inde \u00e7al\u0131\u015farak, \u00fcretim s\u00fcre\u00e7lerini h\u0131zland\u0131racak ve m\u00fc\u015fteri taleplerine daha h\u0131zl\u0131 yan\u0131t verilmesini sa\u011flayacak.<\/p>\n<p>\u0130ki \u015firket aras\u0131nda imzalanan mutabakat zapt\u0131, \u00f6zellikle y\u00fcksek performansl\u0131 bilgi i\u015flem ve ileti\u015fim gibi kritik pazarlara y\u00f6nelik olarak yar\u0131 iletkenlerin paketlenmesi ve test edilmesi alanlar\u0131nda y\u00fcksek hacimli ve ileri teknoloji \u00e7\u00f6z\u00fcmleri sunmay\u0131 hedefliyor. Anla\u015fma, <strong>CoWoS <\/strong>(Chip-on-Wafer-on-Substrate) ve <strong>InFO <\/strong>(Integrated Fan-Out) gibi TSMC&#8217;nin \u00f6nc\u00fc teknolojilerinin ABD\u2019ye getirilmesini sa\u011flayacak.<\/p>\n<p>CoWoS gibi ileri d\u00fczey \u00e7ip paketleme teknolojileri, g\u00fcn\u00fcm\u00fczde y\u00fcksek talep g\u00f6r\u00fcyor. Bu paketleme teknolojileri \u00f6zellikle yapay zeka \u00e7ipleri ba\u015fta olmak \u00fczere y\u00fcksek performansl\u0131 bilgi i\u015flem gibi alanlarda kritik \u00f6neme sahip. ABD\u2019nin kendi kendine yeten bir yar\u0131 iletken \u00fcretim ekosistemi olu\u015fturma \u00e7abalar\u0131n\u0131 g\u00f6z \u00f6n\u00fcne al\u0131rsak bu i\u015fbirli\u011fi \u00fclke i\u00e7in olduk\u00e7a de\u011ferli diyebiliriz.<\/p>\n\n<p><span style=\"display: block; width: 343.125px; color: rgb(55, 58, 60); font-size: 14px; background-color: rgb(255, 249, 236);\"><\/span><\/p>\n<p>Kaynak :\u00a0<span style=\"background-color: rgb(255, 249, 236); color: rgb(55, 58, 60); font-size: 14px;\">https:\/\/www.donanimhaber.com\/tsmc-gelismis-paketleme-teknolojisi-abd-ye-tasiyor&#8211;182723<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>ABD, son y\u0131llarda yar\u0131 iletken \u00fcretimi ve teknolojisini kendi s\u0131n\u0131rlar\u0131 i\u00e7ine \u00e7ekmek i\u00e7in \u00f6nemli ad\u0131mlar atarken, bu y\u00f6nde at\u0131lan en son ad\u0131m Tayvan merkezli TSMC ile ABD&#8217;li Amkor Technologies aras\u0131ndaki stratejik i\u015fbirli\u011fi oldu. TSMC ve Amkor &#8230;<\/p>\n","protected":false},"author":1,"featured_media":83915,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[8],"tags":[433,1480,168,1801,1719],"class_list":["post-83914","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-teknoloji","tag-abd","tag-isbirligi","tag-teknoloji","tag-tsmc","tag-yuksek"],"_links":{"self":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/83914","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/comments?post=83914"}],"version-history":[{"count":1,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/83914\/revisions"}],"predecessor-version":[{"id":83917,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/83914\/revisions\/83917"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/media\/83915"}],"wp:attachment":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/media?parent=83914"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/categories?post=83914"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/tags?post=83914"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}