{"id":96353,"date":"2025-05-23T07:24:14","date_gmt":"2025-05-23T07:24:14","guid":{"rendered":"https:\/\/ekamu.net\/?p=96353"},"modified":"2025-05-23T07:24:14","modified_gmt":"2025-05-23T07:24:14","slug":"tsmc-high-na-euv-ile-yeni-nesil-cip-uretimine-hazirlaniyor","status":"publish","type":"post","link":"https:\/\/ekamu.net\/index.php\/2025\/05\/23\/tsmc-high-na-euv-ile-yeni-nesil-cip-uretimine-hazirlaniyor\/","title":{"rendered":"TSMC, High-NA EUV ile yeni nesil \u00e7ip \u00fcretimine haz\u0131rlan\u0131yor"},"content":{"rendered":"

<\/span> Yar\u0131 iletken end\u00fcstrisinin lideri TSMC<\/strong>, \u00e7ip \u00fcretiminde devrim yaratacak bir teknolojiye yat\u0131r\u0131m yap\u0131yor. \u015eirket, Hollandal\u0131 \u00fcretici ASML<\/strong>‘den ilk y\u00fcksek say\u0131sal a\u00e7\u0131kl\u0131kl\u0131 (High-NA) a\u015f\u0131r\u0131 ultraviyole (EUV) litografi sistemini 2024\u2019\u00fcn sonuna kadar teslim almay\u0131 ve Hsinchu Ar-Ge merkezine kurmay\u0131 planl\u0131yor. Bu hamle, TSMC’nin 2nm alt\u0131<\/strong> s\u00fcre\u00e7leri geli\u015ftirme hedefine ula\u015fmas\u0131nda kritik bir rol oynayacak. <\/figure>\n

TSMC, ilk High-NA EUV teslimat\u0131na haz\u0131r<\/b><\/p>\n

High-NA EUV<\/strong> litografi, yar\u0131 iletken \u00fcretiminde \u00e7\u0131\u011f\u0131r a\u00e7\u0131c\u0131 bir teknoloji olarak kabul ediliyor. Standart EUV sistemlerine g\u00f6re daha y\u00fcksek \u00e7\u00f6z\u00fcn\u00fcrl\u00fck ve hassasiyet<\/strong> sunan bu teknoloji, \u00e7ip y\u00fczeyindeki desenlemeyi \u00e7ok daha ince bir seviyede ger\u00e7ekle\u015ftirebiliyor. Bu sayede yapay zeka ve di\u011fer ileri teknolojiler i\u00e7in gereken geli\u015fmi\u015f \u00e7iplerin \u00fcretimi m\u00fcmk\u00fcn hale geliyor.<\/p>\n

TSMC, High-NA EUV taray\u0131c\u0131lar\u0131n\u0131 1.4nm<\/strong> \u00fcretim s\u00fcrecinde (A14) kullanmay\u0131 hedefliyor. Seri \u00fcretime 2027 y\u0131l\u0131nda<\/strong> ba\u015flanmas\u0131 planlanan bu s\u00fcre\u00e7, TSMC’nin 2nm ve alt\u0131 teknolojilerdeki liderli\u011fini daha da peki\u015ftirecek. Ancak bu sistemlerin tam kapasiteyle \u00e7al\u0131\u015fabilmesi i\u00e7in yo\u011fun testler ve s\u00fcre\u00e7 optimizasyonlar\u0131 gerekecek. Bu sistemler tam olarak faaliyete ge\u00e7ti\u011finde, TSMC’nin mevcut yeteneklerinin \u00f6tesinde birka\u00e7 teknolojik nesli temsil eden A10 d\u00fc\u011f\u00fcm\u00fcne ilerlemesi bekleniyor. Ek olarak TSMC, 2026\u2019da N2<\/strong> (2nm)<\/strong> s\u00fcrecini devreye alaca\u011f\u0131n\u0131 da a\u00e7\u0131klad\u0131.<\/p>\n

TSMC, liderli\u011fini peki\u015ftirecek<\/b><\/p>\n

\u015eirket, 2019 y\u0131l\u0131nda N7+ s\u00fcreciyle ticari EUV litografisini ilk kullanan \u00fcretici olmu\u015ftu. O zamandan bu yana EUV sistemlerini h\u0131zla geni\u015fletti ve \u015fu anda d\u00fcnya \u00e7ap\u0131ndaki EUV kurulumlar\u0131n\u0131n %56’s\u0131n\u0131 elinde bulunduruyor. 2022\u2019de 84 EUV sistemi i\u015fleten TSMC, 2023 y\u0131l\u0131nda bu say\u0131y\u0131 100\u2019\u00fcn \u00fczerine \u00e7\u0131kard\u0131.<\/p>\n

ASML, tanesi yakla\u015f\u0131k 400 milyon dolar olarak High-NA EUV sistemlerinin teslimatlar\u0131nda bu y\u0131l ba\u015flad\u0131. \u0130lk teslimatlar ise Intel\u2019e yap\u0131ld\u0131. G\u00f6r\u00fcnen o ki s\u0131rada \u015fimdi TSCM var. \u00d6te yandan TSMC\u2019nin bu ekipmanlara erkenden kavu\u015fmas\u0131 Samsung Electronics ile yetenek fark\u0131n\u0131 daha da a\u00e7abilece\u011fi anlam\u0131na geliyor.<\/p>\n\n

<\/span><\/p>\n

Kaynak :\u00a0https:\/\/www.donanimhaber.com\/tsmc-high-na-euv-ile-yeni-nesil-cip-uretimine-hazirlaniyor–184324<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

Yar\u0131 iletken end\u00fcstrisinin lideri TSMC, \u00e7ip \u00fcretiminde devrim yaratacak bir teknolojiye yat\u0131r\u0131m yap\u0131yor. \u015eirket, Hollandal\u0131 \u00fcretici ASML’den ilk y\u00fcksek say\u0131sal a\u00e7\u0131kl\u0131kl\u0131 (High-NA) a\u015f\u0131r\u0131 ultraviyole (EUV) litografi sistemini 2024\u2019\u00fcn sonuna kadar …<\/p>\n","protected":false},"author":1,"featured_media":96354,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[8],"tags":[1513,257,168,1801,369],"class_list":["post-96353","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-teknoloji","tag-euv","tag-sistemler","tag-teknoloji","tag-tsmc","tag-uretim"],"_links":{"self":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/96353","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/comments?post=96353"}],"version-history":[{"count":1,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/96353\/revisions"}],"predecessor-version":[{"id":96356,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/posts\/96353\/revisions\/96356"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/media\/96354"}],"wp:attachment":[{"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/media?parent=96353"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/categories?post=96353"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ekamu.net\/index.php\/wp-json\/wp\/v2\/tags?post=96353"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}